Method of forming an adhesive connection
US6077380A · kind A · utility
140Cited by
14References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 1998 |
| Grant date | Jun 20, 2000 |
| Priority date | — |
| Expiry date | Mar 9, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Solid spheres of substantially uniform size and shape and coated with a lower temperature melting material are formed for use in interconnect arrays, solder pastes, Z-axis conduction adhesives, etc. Drops of two materials are merged in flight forming a coating of the lower melting temperature material on the drop of higher melting temperature material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.