Sputtering system
US6077406A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 16, 1999 |
| Grant date | Jun 20, 2000 |
| Priority date | — |
| Expiry date | Apr 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A sputtering system comprises: a substrate holder for holding a substrate; and a cathode having a magnet therein and holding a target, the cathode being off-axis aligned with respect to the substrate. The cathode may comprise a plurality of cathodes, each of which has a flat backing plate, and two targets supported on both sides of the backing plate, the target being off-axis aligned with respect to the thin-film deposited surface of the substrate. The target may be supported on the side surface of a cylindrical or prismatic cathode body having a magnet therein, and the target being off-axis aligned with respect to the thin-film deposited surface of the substrate. Thus, if at least a part of the plurality of cathodes face the thin-film deposited surface of the substrate to be off-axis aligned, it is possible to enhance the inplane uniformity of film thickness, composition and crystallinity of a thin-film deposited on a substrate having a large diameter while inhibiting the substrate from being damaged by the irradiation with high energy particles, and to accelerate the thin film deposition rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.