Curable polyolefin compositions containing organosilicon compounds as adhesion additives
US6077892A · kind A · utility
2Cited by
14References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 1998 |
| Grant date | Jun 20, 2000 |
| Priority date | — |
| Expiry date | Sep 4, 2018 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The adhesion of cured polyolefin compositions to a variety of substrates is improved using as the adhesion promoter the combination of 1) an organic or organosilicon compound containing at least one epoxy group and 2) at least one compound containing a) at least one silanol or carbinol group or a hydrolyzable silanol group precursor, and b) at least one group that reacts during curing of the polyolefin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.