Method for dissipating heat away from a heat sensitive device using bicarbonate composition
US6078011A · kind A · utility
10Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1999 |
| Grant date | Jun 20, 2000 |
| Priority date | — |
| Expiry date | May 6, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/021
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Methods for heat absorption and heat dissipation, by enclosing a heat sensitive device with between about 10 percent and about 99 percent by weight of a bicarbonate compound. The bicarbonate compound is optionally combined with between about 90 percent and about 1 percent by weight of binder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.