Power semiconductor module
US6078501A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1998 |
| Grant date | Jun 20, 2000 |
| Priority date | — |
| Expiry date | Dec 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electronic module or package is disclosed for providing high reliability and high performance operation. The package comprises a hermetically sealed enclosure having a metallic baseplate and a ceramic cover, and containing one or more circuits or devices therein which typically are power rectifiers, bridges or power control circuitry. One or more power terminals are disposed on a terminal block compliantly supported on or above the baseplate, the terminals extending through the cover in hermetically sealed manner. Signal or control terminals may also be disposed on a terminal block compliantly supported on or above the baseplate, these terminals also extending through the cover in hermetically sealed manner. An adapter plate may be mounted on the cover and containing a plurality of terminals connected to the module terminals. The terminals of the adapter plate can be in any configuration to suit user requirements without requiring a change in the terminal configuration of the module itself. The adapter plate may also contain active and/or passive circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.