Polishing machine
US6080048A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1998 |
| Grant date | Jun 27, 2000 |
| Priority date | — |
| Expiry date | Jul 14, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B47/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The polishing machine of the present invention is capable of improving flatness of work pieces. In the polishing machine, a carrier is formed into a thin plate having a through-hole in which a work piece is accommodated. An upper polishing plate polishes an upper face of the work piece. A lower polishing plate pinches the work piece with the upper polishing plate and polishes a lower face of the work piece. A driving mechanism moves the carrier along a circular orbit in a plane without revolving. With this structure, the upper and lower faces of the work piece, which has been pinched between the polishing plates, are polished by the polishing plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.