Mechanism for removing heat from electronic components
US6081424A · kind A · utility
12Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 1998 |
| Grant date | Jun 27, 2000 |
| Priority date | — |
| Expiry date | May 19, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Heat is removed from electronic components located within a closed housing by the use of a heat-conducting metal clip mounted on the housing cover so as to be in pressure contact with the electronic components. The metal clip includes a U-shaped mounting portion firmly clamped to a clip-mounting wall projecting from the cover, and a series of spring arms extending through a slot opening in the cover into pressure contact with individual electronic components. The clamp force of the clip on the mounting wall is designed to act independently of the pressure exerted by each spring arm on an associated electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.