Resin-encapsulated semiconductor device producing apparatus and method
US6081978A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1999 |
| Grant date | Jul 4, 2000 |
| Priority date | — |
| Expiry date | Dec 2, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin-encapsulated semiconductor device producing apparatus includes resin encapsulating part for encapsulating, into a unitary structure, a semiconductor-chip holding zone of a lead frame or a substrate which holds a semiconductor chip, this encapsulation being made with an encapsulating resin material. The resin encapsulating part has first and second holding members for holding the lead frame or the substrate such that the first and second holding members are opposite to each other through the lead frame or the substrate. At least one of the first and second holding members has a housing concave formed opposite to the holding zone, the housing concave being capable of housing the encapsulating resin material. A resin thickness regulating member for regulating the thickness of the encapsulating resin material is removably disposed on the bottom of the housing concave.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.