Heat dissipation system having releasable attachment assembly
US6082440A · kind A · utility
37Cited by
23References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 1998 |
| Grant date | Jul 4, 2000 |
| Priority date | — |
| Expiry date | Feb 6, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation system for a heat generating electronic device includes a releasable attachment assembly for removably securing a heat sink to a heat spreader plate thereof includes at least one spring clip for biasing the heat spreader plate into a secured engagement with the heat sink. The spring clips are adapted to allow easy engagement and/or disengagement of the heat sink from the heat spreader plate, thereby facilitating the use of variously configured heat sinks as part of the heat dissipation system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.