Structure bonded with an electrically conductive adhesive
US6083615A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1997 |
| Grant date | Jul 4, 2000 |
| Priority date | — |
| Expiry date | Jul 16, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/8305
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A structure is formed of at least two structural elements that are bonded together with an electrically conductive organic adhesive system. The adhesive system is a mixture of an organic adhesive such as a thermosetting epoxy and a filler of electrically conductive carbon particles having a porous, sponge-like structure. In one application, the structural elements are exterior panels of a spacecraft coated with an electrically conductive paint, and in other applications the structural elements are not coated. The adhesive system permits static electrical charge to flow through otherwise insulated joints to equalize the static potential throughout the structure and eventually to dissipate the charge.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.