Method of forming an alignment mark
US6083806A · kind A · utility
4Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 1998 |
| Grant date | Jul 4, 2000 |
| Priority date | — |
| Expiry date | Jul 6, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An alignment mark (51) is formed on the surface (64) of a silicon carbide substrate (50). The alignment mark (51) is used to reflect a light signal (72) to determine the proper position for the silicon carbide substrate (50). The materials that are used to form the alignment mark (51) can be used to form an alignment mark on any transparent or semi-transparent substrate and will maintain physical integrity through very high temperature processing steps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.