Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US6084178A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 27, 1998 |
| Grant date | Jul 4, 2000 |
| Priority date | — |
| Expiry date | Feb 27, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49947
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package for heat sinks and semiconductor components that adequately dissipates heat from semiconductor components without damaging or bending the semiconductor component electrical grid terminals and without imposing mechanical stress on the semiconductor component. The package includes both the heat sink and the semiconductor component situated in one unit that minimizes the thermal path. The heat sink and semiconductor component package may be packaged in a field replaceable unit (FRU) and may act as a handle for use in its own replacement. The FRU contains the heat sink and the semiconductor component in one unit, and thereby enables safe, simplified, and cost effective maintenance, including removal and addition of the semiconductor components, outside of the manufacturing environment. The package further includes a docking assembly mounted on a printed circuit board that orients and positions the FRU to align the semiconductor component and the electrical grid terminals for insertion on the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.