Underwater laser processing method and apparatus
US6084202A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 1998 |
| Grant date | Jul 4, 2000 |
| Priority date | — |
| Expiry date | May 15, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E30/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An underwater laser processing method is carried out by irradiating, through a laser beam irradiation apparatus, a laser beam having a high output, a short pulse and a visible wavelength to a surface of a structure immersed in a water to improve residual stress of a material of the surface of the structure and remove a crack or a CRUD thereof. The laser beam irradiation apparatus comprises a pulse laser device suspended into a water in which a metal material is accommodated from an upper side thereof for irradiating a laser beam having a visible wavelength to a processing position, a beam strength adjusting device for adjusting an output per 1 pulse of a laser beam generated by the pulse laser device and a mechanism for adjusting a spot diameter and a multiplexing ratio of an irradiated beam.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.