Semiconductor light emitting device
US6084252A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 1998 |
| Grant date | Jul 4, 2000 |
| Priority date | — |
| Expiry date | Jul 10, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Obtained is a semiconductor light emitting device in which a light emitting device chip is bonded on a first lead and a second lead is electrically connected to one electrode of the light emitting device chip. Besides, the light emitting device chip and the top end of the second lead are enclosed by resin which a light from the light emitting device chip transmits. The first and second leads are respectively enclosed by heat resistant enclosing material along predetermined lengths of both leads at the bottom of the package, which is opposed to the light emitting surface. As a result, adhesiveness between the resin package and the leads is improved and thereby prevented is corrosion of the leads and the light emitting device chip in the package from occurring, which can make reliability improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.