Intergrated processor substrate protective enclosure for use in desktop PC systems
US6084773A · kind A · utility
12Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 1998 |
| Grant date | Jul 4, 2000 |
| Priority date | — |
| Expiry date | Feb 17, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/026
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic cartridge which includes a cover. The cover is coupled to a substrate which has an integrated circuit package. A portion of the cover extends over and is spaced from a plurality of conductive pads located along an edge of the substrate. The conductive pads can be inserted into a card edge electrical connector that is mounted to a motherboard. The cover of the present invention protects the conductive pads while allowing the substrate to be plugged into a card edge connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.