Electronic device having self-aligning solder pad design
US6084782A · kind A · utility
9Cited by
9References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1997 |
| Grant date | Jul 4, 2000 |
| Priority date | — |
| Expiry date | Jun 2, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49133
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate (200) to which a component (210) is mounted includes at least two mounting pads (215, 220) formed thereon for electrically coupling to a single terminal of the component (210) and for aligning the component (210) on the substrate (200) during a reflow operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.