Method of making a flexible circuit with raised features protruding from two surfaces and products therefrom
US6085414A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1998 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Jul 30, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49156
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process using a shim stock or foil to make flexible circuits having raised pressure contact features protruding outwardly from two surfaces. A first set of raised electrical pressure contact features are made by placing a shim stock or foil of stainless-steel on a piece of soft metal or other suitable substrate and forcing a tool into the foil to form dimples in one face. Thereafter, the foil is turned over and the process repeated on the other face of the foil. The resultant foil includes a first face having a first dimple and a first bump extending outwardly from the first face. A flash coating is formed on the foil and electrical traces are deposited on the first face of the foil including into the first dimple and over the first bump. A dielectric substrate is selectively deposited over the electrical traces and the complete subassembly is removed from the foil. A flash coating is etched away and optionally a second dielectric substrate is selectively deposited over the electrical traces. The resulting flexible circuit has raised features protruding from two surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.