Methods to produce insulated conductive through-features in core materials for electric packaging
US6085415A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 1998 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Jul 27, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1057
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods for the production of insulated, conductive through-features in conductive core materials for electronics packaging are disclosed. Invention methods employ protective mask technology in order to facilitate the selective removal of material from planar conductive core material that has been encapsulated in electrically insulated materials. By filling the cavity in the conductive core material with an electrically insulated material, the through-feature is electrically isolated from the remainder of the core material. In this manner, a conductive through-feature that completely transverses the core of the substrate board is created. Also provided are planar substrates for multilayer printed circuit boards, or chip carriers, comprising the conductive through-features produced by invention methods.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.