Sputtering target assembly production method
US6085966A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 3, 1997 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Dec 3, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for producing a sputtering target assembly consisting of a target member used for sputtering and a backing plate bonded to the target member, which assembly has a high adherence strength and a high bonding strength as well as a sufficient tensile strength even under a high temperature. When producing a sputtering target assembly consisting of a target member used for sputtering and a backing plate bonded to the target member, bonding surfaces of the target member and the backing plate are made flat so as to have an arithmetic mean roughness Ra of 0.01 to 1.0 .mu.m before carrying out solid phase diffusion bonding between the target member and the backing plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.