Method of fabricating electronic device employing a flat flexible circuit and including the device itself
US6086384A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1997 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Aug 22, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/326
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of fabricating an improved electronic device, along with the product of that method is disclosed. A flat flexible substrate is provided with a generally round hole of a given diameter and with a conductive film on the substrate in an area at least about the hole. A generally round terminal pin is provided with a given diameter greater than that of the hole. The difference between the diameter of the pin and the diameter of the hole is on the order of 5% to 50% of the diameter of the hole. A non-conductive adhesive is applied to a portion of the pin or the substrate surrounding the hole. The pin is inserted into the hole in the substrate such that the non-conductive adhesive is scraped longitudinally from or along the pin to an area about the hole and the pin, leaving the pin in contact with the conductive film. An improved interface is established between the pin and the conductive film of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.