Method of fabricating a semiconductor device using a CMP process
US6086454A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1997 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Jul 29, 2017 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus includes a rotatable platen, a first driving device for causing the rotatable platen to rotate, a polishing head provided above the platen rotatably and holding a substrate in a manner such that the substrate faces the platen, a second driving device for causing the polishing head to rotate, an urging device for urging the substrate on the polishing head against the platen, a slurry feeding system for feeding a slurry to the platen, and a cleaning system for supplying a cleaning liquid containing an acid that dissolves a manganese oxide, to the polishing head. The cleaning system includes a nozzle provided in the polishing head for spraying the cleaning liquid to the platen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.