Protective enclosure for a multi-chip module
US6088228A · kind A · utility
19Cited by
14References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 1998 |
| Grant date | Jul 11, 2000 |
| Priority date | — |
| Expiry date | Dec 16, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/142
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipating element, positioned inside a protective cover, removes heat from the vicinity of a multi-chip module comprising active semiconductor devices attached to a printed circuit board. Attachment of the protective cover to the printed circuit board uses a latching mechanism with minimum board space requirements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.