Method for producing a carrier element for semiconductor chips

US6088901A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Michael Huber · Bad Abbach, DE
• Peter Stampka · Burglengenfeld, DE
• Detlef Houdeau · Langquaid, DE
• Jurgen Fischer · Backnang, DE
• Josef Heitzer · Neutraubling, DE
• Helmut Graf · Regensburg, DE

Key dates

• Filing date: Dec 14, 1998
• Grant date: Jul 18, 2000
• Expiry date: Dec 14, 2018

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1056
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A carrier element for a semiconductor chip, in particular to be built into smart cards. The carrier element has a substrate that carries the chip and a stiffening sheet which also carries the chip and has a recess for receiving the chip and its connection leads therein. An edge of the recess is provided with a frame formed integrally from the sheet.