Polishing pad
US6089965A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 1999 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Jul 12, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D13/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad that can polish the surface of work pieces, such as semiconductor silicon wafers, with satisfactory results. Polishing pad 1.sub.1 is formed of a large number of resin polishing elements 11, all tubular with a very small diameter, inseparably bound together, outer peripheral surface to outer peripheral surface, with the axial direction tube end faces aligned on a plane, to form a plate structure 10 with two kinds of pores 12, 13, which are regularly positioned and run through the plate structure 10 in the thickness direction. Pad surface 1a of polishing pad 1.sub.1 is formed by the axial direction tube end faces of polishing elements 11 . . . . First pore 12 is the center pore in the polishing element 11. Second pore 13 is formed between the outer peripheral surfaces of the polishing elements 11 . . . .
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.