Laser processing method
US6090330A · kind A · utility
40Cited by
8References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 1998 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Jan 9, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0165
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The two ends of an article to be processed which is in the form of a sheet are held by means of a fixed clamp and a movable clamp, the article being held by applying bias by means of a biasing cylinder to the movable clamp in a direction such as would separate it from the fixed clamp and hole-forming processing being performed by means of a laser beam. Since the sheet-like article is held under tension, flatness of even a thin sheet can be maintained and since the underneath space is open, there is no reflection of laser light after passing through the holes that are formed and any processing waste can easily be removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.