Thermal microplatform
US6091050A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 17, 1997 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Nov 17, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/003
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A micromachined platform structure includes a substrate having a major surface and a platform positioned over the major surface. Plural support beams are tethered between the substrate and the platform, with each support beam including at least a first layer exhibiting a first thermal coefficient of expansion (TCE) and a second layer with a second TCE, the first TCE greater than the second TCE. The first layer is deposited on the second layer at a temperature that is higher than an ambient temperature at which the platform is to be used. Thus, at the ambient use temperature, the first layer is in a contraction/tension state relative to the second layer and causes a flexure of the support beams and an elevation of the platform away from the substrate's major surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.