Method and apparatus for temperature control of a semiconductor electrical-test contractor assembly
US6091062A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1998 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Jan 27, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2874
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device handler with a temperature controlled test area. Temperature control is provided in part through the use of temperature controlled air forced across the test area. For heating the test area, electrical resistance heaters are uniformly distributed through the test area and are controlled to provide the desired temperature. The handler has a close pitch between adjacent sockets such that is not possible to distribute refrigeration elements over the test area. Instead, a refrigeration element is placed on one side of the test area. To prevent formation of an undesirable temperature gradient, heat is injected at a specific location in the test area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.