Ceramic lid for large multi-chip modules
US6091146A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 9, 1997 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Dec 9, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15192
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A reworkable multi-chip module contains a large multi-chip module package (2) with an opening at the top to permit access to an internal region for semiconductor devices, the opening being at least four square inches area with the length or width dimension being at least two inches. The opening is sealed with a stiff closure (1) of sufficient rigidity to withstand at least one atmosphere of differential pressure without significant deflection, is removable in a single piece and may be reinstalled. The closure includes a panel of electrically non-conductive material (3) and a metal flange (5) borders the periphery of the panel to support the panel on the top of the module package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.