Semiconductor pellet having plural chips
US6091156A · kind A · utility
4Cited by
2References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 29, 1997 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Aug 29, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor pellet comprising first and second semiconductor chips being diced from a wafer, a first bonding-pad formed at a first peripheral portion of said first chip, and a second bonding-pad formed at second peripheral portion of said second chip, which bonding-pads are arranged so as to keep symmetry after rotating around the central point of said pellet by 180 degrees. Judging whether the first chip is good or not and if the chip is not good, then the pellet is rotated around the central point thereof by 180 degrees, and it is mounted onto a chip carrier. Then wire-bonding is conducted.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.