Heat spreader for electronic ballast
US6091199A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1997 |
| Grant date | Jul 18, 2000 |
| Priority date | — |
| Expiry date | Jul 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An insulating enclosure for an electronic ballast has at least one major surface and a thermally conductive heat spreader at the major surface. The heat spreader is thermally coupled to at least one of the electronic components within the ballast and has an area greater than the area of the component as measured parallel with the major surface. The electronic components are thermally coupled to the heat spreader by a thermally conductive, deformable means such as caulk or by domes or dimples in the heat spreader that accommodate the variations in height among the electronic components. An electrically insulating layer can be located between the heat spreader and some of the components to prevent the heat spreader from electrically shorting the components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.