Thermal monitoring system for semiconductor devices
US6092926A · kind A · utility
30Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 1998 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | Sep 17, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/42
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for monitoring the operating temperature of a semiconductor device. The method comprising the steps of: placing a thermal coupling material between the bottom of the semiconductor device and the top of a printed circuit board for inserting the device thereinto; inserting a sensor so to be at least partially covered by the thermal coupling material; and measuring the temperature from the sensor within a predetermined time interval. In accordance with another aspect of the invention, an apparatus is described to carry out the above process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.