Bonding process

US6093270A · kind A · utility

Assignee

• Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

• Andreas Ferencz · Goldkronach, DE
• Norbert Huebner · Goldkronach, DE
• Herbert Fischer · Goldkronach, DE
• Lothar Unger · Erkrath, DE
• Bernd Peters · Dülmen, DE
• Wolf-Ruediger Mueller · Hilden, DE
• Horst Donothek · Monheim, DE
• Joerg Kuhn · Rheydt, DE

Key dates

• Filing date: Nov 24, 1997
• Grant date: Jul 25, 2000
• Expiry date: Nov 24, 2017

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08G2250/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The proposed process for bonding together two substrates with an anhydrous or low-water-content partially crystalline adhesive which is solid at room temperature is characterized in that the adhesive is first activated by internal and/or external friction. The substrates are then joined together with the adhesive between them. When allowed to stand, the structure attains its final strength after a period of between a few seconds to a few days. The friction destroys the crystalline structure and causes the adhesive to become gluey, and re-crystallization gives it its final strength and eliminates the gluey quality. The adhesive is based preferably on polyester or polyurethane and used preferably in the form of a gum stick without impermeable packaging. It is especially suitable for bonding paper, since it does not cause corrugation.