Low temperature adhesion bonding method for composite substrates
US6093577A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1997 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | Jul 30, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68363
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of bonding a first substrate (10) to a second substrate (30) is described, comprising the steps of: coating an adhesive (28) onto a first major surface of said first substrate (10); aligning said first and second substrates (10, 30) so that said coated first major surface of said first substrate (10) is facing said second substrate (30) and is separated therefrom by a gap (47); deflecting at least one of said first and second substrates (10, 30) by exerting a pressure between said first and second substrates (10, 30) substantially at the center thereof so that the adhesive coating (28) substantially at the center of said first substrate (10) comes into contact with said second substrate (30); and allowing the remaining parts of said adhesive coated first major surface of said first substrate (10) to come into contact with said second substrate (30). Use of the method to produce composites, in particular transmissive liquid crystal display panels is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.