Thermoplastic moulding compounds based on vinyl aromatic polymers with syndiotactic structure, low-viscosity polyamides and polyphenylene ethers modified with polar groups
US6093771A · kind A · utility
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Key dates
| Filing date | Sep 21, 1998 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | Sep 21, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/905
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermoplastic molding compositions comprise PA1 A) from 5 to 97.9% by weight of a vinylaromatic polymer with syndiotactic structure, PA1 B) from 2 to 90% by weight of a low-viscosity polyamide with a viscosity number VN in the range from 50 to 150 ml/g and PA1 C) from 0.1 to 50% by weight of a polar-group-modified polyphenylene ether.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.