Patent · US Expired

Thermoplastic moulding compounds based on vinyl aromatic polymers with syndiotactic structure, low-viscosity polyamides and polyphenylene ethers modified with polar groups

US6093771A · kind A · utility

8Cited by
0References
5Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 21, 1998
Grant dateJul 25, 2000
Priority date
Expiry dateSep 21, 2018

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S525/905
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

Thermoplastic molding compositions comprise PA1 A) from 5 to 97.9% by weight of a vinylaromatic polymer with syndiotactic structure, PA1 B) from 2 to 90% by weight of a low-viscosity polyamide with a viscosity number VN in the range from 50 to 150 ml/g and PA1 C) from 0.1 to 50% by weight of a polar-group-modified polyphenylene ether.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.