Stacked die integrated circuit device
US6093938A · kind A · utility
21Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 1999 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | May 25, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A compound die may be formed of two dies each having face and back sides, said dies being connected with said dies in face to face alignment. A radiation communication system may be used to assist in aligning the dies and in providing communications between the two dies. In this way, a composite structure may be produced which has advanced capabilities, a small footprint, and low impedance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.