Dual channel microwave transmit/receive module for an active aperture of a radar system
US6094161A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1999 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | Dec 8, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/0025
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. The MMICs which generate substantially all of the heat are located in multi-level cavities formed in the substrate and …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.