Feedforward amplifier manufacturing module
US6094350A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 4, 1999 |
| Grant date | Jul 25, 2000 |
| Priority date | — |
| Expiry date | Jun 4, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2201/3218
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A manufacturing module for an RF feed-forward amplifier subsystem that allows for simple and cost-effective assembly, yet provides separate compartments for the different stages of the subsystem, with low RF leakage between the compartments is disclosed. The manufacturing module comprises a printed circuit board having one or more circuit trace layers, and ground planes covering a substantial portion of the top and bottom surfaces. The printed circuited board also has numerous plated-through holes electrically connecting the top and bottom ground planes. The circuit board is sandwiched between a heatsink having a flat upper surface and a machined enclosure having an outer wall and inner divider walls. The plated-through holes, space less than 1/10 wavelength of module's highest carrier frequency apart, serve to electrically connect the heatsink to the machined enclosure, thus creating separate compartments with low RF leakage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.