Method of form and seal packaging
US6094889A · kind A · utility
42Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1997 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Feb 25, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31913
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A film having a polypropylene surface layer and a polyethylene surface layer is used in fill and seal packaging applications, in which the polyethylene layer consists essentially of a ethylene copolymer having a narrow molecular weight distribution ethylene and a CBDI of greater than 50%. The package is formed by heat sealing the polyethylene surface to the polypropylene surface of the film to form a transverse seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.