Package with integrated thermoelectric module for cooling of integrated circuits
US6094919A · kind A · utility
195Cited by
5References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 4, 1999 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Jan 4, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for an integrated circuit (IC) comprises a lid attached to a base, with the IC being disposed in a space or cavity between the lid and the base. A thermoelectric module (TEM) having first and second primary surfaces is incorporated into a section of the lid. The first primary surface is thermally coupled to the IC such that application of power to the TEM causes heat to be transferred away from the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.