Patent · US Expired

Solder deposit support

US6095397A · kind A · utility

15Cited by

15References

12Claims

0Family size

Assignee

Max-Planck-Gesellschaft zur Föderung der Wissenschaften e.V. · US

Inventors

Jurgen Wolf · Kriftel, DE
Gerhard Chmiel · Dülmen, DE

Key dates

Filing date	Jun 29, 1998
Grant date	Aug 1, 2000
Priority date	—
Expiry date	Jun 29, 2018

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/0726
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Solder deposit carrier for the selective soldering of terminal areas of a substrate, comprising on an electrically conductive, non-wettable or wetting-inhibiting coating (12) a transfer mask (13) of an electrically isolating, non-solderable material which exposes the coating in the area of mask openings (14), in which the mask openings (14) serve to accommodate solder deposits (16) electroplated to the coating (12), and the coating (12) comprises two superimposed metal layers (15, 17) of different materials, such that the layer (17) facing towards the mask openings (14) is non-wettable or has a wetting-inhibiting effect, and the layer (15) arranged facing away from the mask openings (14) acts as a current-carrying layer during the electroplating.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.