Method of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card module
US6095423A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 16, 1999 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Feb 16, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The smart card module has a supporting plate which has a first contact plane and a semiconductor chip and electrically conductive connections between the semiconductor chip and the first contact plane. Apart from the first contact plane, the smart card module has, on the reverse side of the supporting plate, another connection plane that is also electrically connected to the semiconductor chip. The other connection plane may be used, for example, for turning on a built-in induction coil inside the chip body for contactless data transfer. The invention relates also to a combined smart card for contacting and contactless data transfer, which contains the smart card module. A manufacturing process is specified with a given sequence of process steps leading to the production of the smart card module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.