Spatially uniform deposition of polymer particles during gate electrode formation
US6095883A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1997 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Nov 3, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2329/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for uniformly depositing of polymer particles onto the surface of a gate metal during the formation of a gate electrode. In one embodiment, the present invention comprises immersing a substrate having a layer of a gate metal disposed over the surface thereof in a fluid bath containing polymer particles. In this embodiment, the fluid bath is contained within a fluid bath tank. Additionally, in the present embodiment, the layer of the gate metal disposed over the substrate has a thickness approximately the same as a desired thickness of the gate electrode to be formed. Next, the present embodiment applies a uniform potential across the surface of the layer of gate metal such that the polymer particles are uniformly deposited onto the layer of the gate metal. In so doing, the present embodiment uniformly deposits the polymer particles onto the layer of the gate metal. In the present embodiment, the polymer particles adhere to the surface of the layer of the gate metal via Van der Waal's forces and/or via a charge difference between the layer of the gate metal and each of the polymer particles. In this embodiment, the polymer particles are deposited over the surface of the lay…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.