Grinding and polishing machines
US6095897A · kind A · utility
9Cited by
7References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 1999 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Mar 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A grinding machine for grinding the edge of a disc or wafer comprises a grooved grinding wheel 308, means for transporting the wafers before or after grinding, and a housing 332 in which wafers 340 are parked on a vacuum chuck 336 awaiting inspection. A jet 338 protrudes into the housing and directs water or air towards the face and edge of the wafer on the chuck. The transport means then transfers wafers to an inspection station.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.