Method for using inspection data for improving throughput of stepper operations in manufacturing of integrated circuits
US6096093A · kind A · utility
15Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 1997 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Dec 5, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for managing stepper operations required during the manufacturing of an integrated circuit die having at least one known defect, as determined by inspection, comprises the steps of determining, based upon an analysis of the connectivity and defect information relating to the die having at least one known defect a probability of failure to each at least one known defect and eliminating from stepper operations any die having at least one fatal defect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.