Patent · US Expired

Method for fabricating adhesion-resistant micromachined devices

US6096149A · kind A · utility

32Cited by
3References
24Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 21, 1997
Grant dateAug 1, 2000
Priority date
Expiry dateApr 21, 2017

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T156/11
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A method for fabricating an adhesion-resistant microelectromechanical device is disclosed wherein amorphous hydrogenated carbon is used as a coating or structural material to prevent adhesive failures during the formation and operation of a microelectromechanical device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.