Reflow soldering apparatus with a rotative configuration
US6096999A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1998 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Feb 26, 2018 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to an apparatus for subjecting objects to processes, wherein the apparatus comprises a plurality of chambers wherein are each adapted to contain at least one object; and processing devices for processing objects present in the chambers, wherein the chambers are adapted to successively perform different processes on the object present in the chamber. According to a first embodiment, the chambers are moveable in accordance with a closed circuit and the processing devices are adapted to perform a process on the object which is present in a chamber present in a defined position. According to a second embodiment the chambers are arranged fixedly and transporting means are arranged to carry the objects for processing and the processed objects in and out of the chambers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.