Semiconductor device having magnetic shield layer circumscribing the device
US6097080A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Oct 19, 1998 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Oct 19, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
It is the object to minimize a magnetic influence, on the outside, of a semiconductor chip which is formed on a substrate includes inductor conductors. A semiconductor chip 2 including inductor conductors is mounted on a substrate 1 and a plurality of through holes 8 are formed in the area on the outside of the mounting position. Shielding members 4 are formed on the chip mounting side and the opposite side of the substrate 1 and in the through holes 8 so as to cover the semiconductor chip 2 with the shielding members 4 from both sides of the substrate 1. Therefore, magnetic fluxes from a circuit formed on the semiconductor chip 2 do not leak out from the shielding members 4, but circulate inside the shielding members 4.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.