Semiconductor device which is crack resistant
US6097083A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 1997 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Apr 10, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin mold type semiconductor device, which is crack resistant and can be made relatively thin, includes a semiconductor chip, a lead member arranged in a manner such that an one side face of a head portion thereof touches a surface of the semiconductor chip, a wire for electrically connecting the surface of the semiconductor chip and another side face of the lead member, an adhesive member for adhering the one side face of the lead member and a peripheral face of the semiconductor chip, and a package for molding the semiconductor chip, a part of the lead, the wire and the adhesive member by synthetic resin. Further, the lead member may be provided with a concave portion in the one side face and possibly also a groove extending from the concave portion to an end of the lead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.