Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package
US6097089A · kind A · utility
80Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1999 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Jan 27, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0369
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided a semiconductor plastic package in the form in which at least one semiconductor chip is mounted on a small-sized printed wiring board, a metal plate for the above package and a method of producing a copper-clad board for the above package. More particularly, there is provided a semiconductor plastic package suitable for relatively high-watt, multi-terminal and high-density semiconductor plastic packages such as a microprocessor, a micro-controller, ASIC and graphic, and a method of producing the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.