Retention mechanism for heat sink
US6097601A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 15, 1999 |
| Grant date | Aug 1, 2000 |
| Priority date | — |
| Expiry date | Oct 15, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A retention mechanism for securely engaging a heat sink with a CPU module comprises a base plate and a guiding member. The base plate has a H-shaped main body and two pairs of mounting legs upwardly extending from corners thereof for engaging with a CPU module and a heat sink. Each mounting leg forms a resilient tip on a free end thereof and a pair of cutouts proximate the resilient tip. The guiding member forms a shaft and a pair of latching arms outwardly extending from opposite ends of the shaft. A pair of elongate engaging slots is defined in each latching arm corresponding to the mounting legs. A receiving aperture is defined in communication with each engaging slot for insertion of the tip of the corresponding mounting leg therethrough. A pair of engaging tabs is formed on opposite sides of each engaging slot for engaging with the corresponding cutouts of the mounting legs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.